PA66 A3EG6 German Basf Inc property data

①material description specification levels: injection molding grade color: -

Use summary: the need for high rigidity and dimensional stability of mechanical components.

Note: the characteristics: glass fiber reinforced

The raw material technical data performance project test conditions [state] test method test data data unit

Mechanical properties tensile elastic modulus of dry / wet - 10000/7200 MPa

Tensile yield stress ( V=50mm/min ) dry / wet - 190/130 MPa

Fracture stress ( V=50mm/min ) dry / wet - 190/130 MPa

Elongation at yield ( V=50mm/min ) - 3/5% of dry / wet

Elongation ( V=50mm/min ) - 3/5% of dry / wet

Tensile creep modulus 1000h, wet - 5300 MPa

Elongation rate≤ 0.5%, +23 ℃, wet - 5300 MPa

Bending modulus of dry / wet - 8600/7000 MPa

Bending strength of dry / wet - 280/220 MPa

Card impact strength of +23 ℃, dry / wet - 85/100 KJ/m2

Card impact strength at 30 ℃, stem - 70 KJ/m2

Card notch impact strength of +23 ℃, dry / wet - 13/22 KJ/m2

Card notch impact strength at 30 ℃, dry / wet - 11 KJ/m2

Notch impact strength of +23℃, dry / wet - 11.5/15.5 KJ/m2

Shock, fracture energy +23 ℃, dry / wet - 3/15 J

Ball indentation hardness of dry / wet - 270/200 MPa

Electrical properties of dielectric constant of 1MHz, dry / wet --- 3.5/5.6 ---

Loss angle 1MHz, dry / wet --- 0.014/0.16 ---

Volume resistance of dry / wet - 1015/1012 Ω.Cm

Surface resistance of dry / wet - 1012/1010 Ω

Dielectric strength K20/P50, dry / wet - 90/80 KV/mm

Relative arc index CT1 wet / dry - 550 - CTI

Thermal energy heat capacity ratio dry - 1.5 J/ ( g.K )

Linear coefficient of thermal expansion ( 23-80 )℃, dry - 1.5-2/6-7 10-5/K

Thermal conductivity of dry - 0.24 W/ ( m.K )

Heat distortion temperature 1.8MPa load, dry - 250 ℃

Heat distortion temperature 0.45MPa load, dry - 250 ℃

Maximum use temperature - 240 ℃

Temperature index in 20000h/5000h, after the tensile strength decreased 50% - 120/150 ℃

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